ABERDEEN PROVING GROUND, Md. — The U.S. Army signed a new cooperative agreement with Johns Hopkins University Sept. 30, 2020, to advance materials research using artificial intelligence and machine learning.
Researchers from the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory will collaborate with Johns Hopkins faculty and students on four focused projects:
- Using artificial intelligence to accelerate the iterative materials design cycle by high-throughput microstructural characterization and rapid processing
- Acoustic signature and reconstruction of defect avalanches in metals
- Real-time monitoring of laser-material interactions
- Toward self-repairing devices: Data-directed design of active, hierarchical colloidal assembly and reconfiguration
Image: https://www.army.mil/article/240874/army_teams_with_johns_hopkins_to_advance_materials_research
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